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| New Microelectronics Research & Development Facility |
Total Square Feet: 64,000 s/f
Project Description:
Turn-key design and construction of a new, ground-up Microelectronics Research and Development Lab Facility, including a 2-story office/admin building and 3-level R&D fabrication building. Initial ATC programs are focused on fast-cycle of new 193nm photoresists and antireflectant coatings. Further programs will include work on low-k dielectrics, copper interconnect and lithography materials to support 157nm, EUV and e-beam technologies.
Project Features: 5,000 s/f Class 10 "ballroom" cleanroom on waffle slab with a mechanical equipment mezzanine above and a process basement below
Very tight tolerances on temperature, relative humidity, noise, vibration, and molecular out-gassing
Modular cleanroom design allows doubling facility size for future expansion |
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